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Samsung said to outsource DDR5 module assembly to focus on HBM

MobiFacts ·

Industry reports say Samsung will hand DDR5 module and SSD assembly to three OSAT partners in India, Vietnam and the Philippines, while converting Cheonan packaging lines, backed by a KRW 10 trillion investment, to HBM from next year.

Not confirmed. This comes from leaks and industry reports rather than the manufacturer. Treat the details as provisional.

The details

  • GSMArena reported on 17 September 2026 that Samsung plans to outsource DRAM manufacturing and reallocate its own capacity to HBM production, citing The Elec.
  • Tech Edition reported that the work being outsourced is the assembly and testing of DDR5 modules and SSDs, not chip fabrication.
  • Tech Edition stated that DDR5 modules are produced by mounting prepackaged DRAM and NAND chips onto circuit boards using surface-mount technology.
  • The three outsourcing partners named in the reports are Dreamtech in India, Hanyang Digitech in Vietnam and SFA Semicon in the Philippines.
  • Tech Edition reported that Dreamtech's Noida facility in India is expected to reach an annual capacity of more than 50 million units.
  • Tech Edition reported that Hanyang Digitech invested more than 31.5 billion won in 2026 on automation for its Vietnam operation.
  • Tech Edition reported that SFA Semicon is moving equipment from Onyang to a new facility in the Philippines, with the transition beginning in November.
  • TrendForce reported that Samsung will convert back-end packaging equipment at its Cheonan plant from Exynos mobile processor packaging to HBM packaging beginning next year.
  • TrendForce reported that Samsung invested KRW 10 trillion to modernise its HBM facilities in Cheonan.
  • TrendForce reported that Cheonan will continue packaging the Exynos 2600 for the Galaxy S26 series and Galaxy Z Flip 8, while Exynos 2700 packaging moves to the Onyang plant.
  • TrendForce reported that Samsung urged its OSAT partners to expand capacity for conventional memory module production rather than building in-house capacity, and cited Sisa Journal, Yonhap News and The Elec as its sources.

Why it matters

If the largest memory maker converts consumer DRAM capacity to HBM for AI accelerators, the memory in ordinary phones and laptops competes for the same fabs — which is how a data-centre boom reaches a retail price tag.

Sources